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Blog - Bittele ElectronicsDESCRIPTION
This page contains four articles that discuss the benefits of buried capacitance in PCB production, the use of via in pad technology for high density PCBs, a description of FR-4 PrepregBonding stage materials, and methods for controlling impedance in a transmission line.CONTENT
This site blog.7pcb.com has the following on the site, "How Decoupled Capacitance can be Obtained without Components? Desired Buried Capacitance Examples." Our analyzers noticed that the website also said " The diagrams inserted below give the popular ways that Buried Capacitance can be used." The Website also stated " If you need more information, you can get it from your board producer. Via in Pads and BGA. A trade-off to get intermediate cost with intermediate density as compared to buried or blind vias is filled via in pad. Listed below are some important benefits of using via in."